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Integration of electronics into textiles

About the project

TECHNOLOGY IS USED BY THESE RE-FREAM PARTNERS

  • Fraunhofer IZM (Berlin, Germany)

TECHNOLOGY IS USED IN THESE RESEARCH-HUBS

ABOUT THE TECHNOLOGY

When developing e-textile systems, the electrical and mechanical connection of mostly hard components with soft, flexible materials is a major challenge. Standard technologies such as soldering are not suitable for temperature-sensitive textiles, and embroidered contacts offer insufficient protection against short circuits and environmental influences. Fraunhofer IZM specializes in the development of textile-compatible connection solutions and, within the scope of this project, offers access to the latest and more advanced technologies such as non-conductive adhesive bonding, ultrasonic plastic welding, low-temperature soldering or mechanical connectors. This enables the development of samples batches, small series and is also suitable for production.

USUAL AREAS OF APPLICATION

Smart Textiles.

MATERIALS USED IN RE-FREAMSilver, copper

ASSIGNED PROJECTS WITHIN RE-FREAM

WATCH THE TECHNOLOGY

Fraunhofer IZM - Low-temperature soldered LEDs on stretchable circuit board that is laminated onto textile
  Fraunhofer IZM – Low-temperature soldered LEDs on stretchable circuit board that is laminated onto textile
Fraunhofer IZM - Bonded Smart Pixel interposer onto woven fabric substrate
Fraunhofer IZM – Bonded Smart Pixel interposer onto woven fabric substrate